IC Heat Spreader ,Sputtered Strip-Type Heat Sink
Model: HOS100CC4-SS05
Exhibitor: TOP Nanometal Corporation
Booth No: TBA
Characteristic
This product is a high-performance thermal solution designed for IC packaging, such as BGA and FCBGA. Using an eco-friendly roll-to-roll sputtering process, it applies nanoscale and micrometer scale metallic thin layers onto high-thermal-conductivity electronic-grade copper foil to form a high-efficiency strip-type heat spreader. Built with electronic-grade copper foil and high-conductivity metal thin layers to enhance heat conduction and heat dissipation Contains no RoHS-restricted hexavalent chromium (Cr??) — only natural metallic chromium (zero-valent chromium) is used, fully compliant with global environmental regulations More uniform film thickness and more stable performance compared to traditional electroplated heat spreaders No additional solder-mask / green-paint coating required, preventing heat dissipation loss and improving thermal efficiency by approximately 5–10% Ideal for high-density IC packages (FCBGA, BGA) and applications requiring strong thermal reliability
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Processing examples:FCCL(ROLL)
