TPCA Show X IMPACT- Market Trend-AI-Powered in Semiconductor Packaging
Applied Materials, Resonac, Sony, SciTech Power 與 Yole 專家齊聚, 洞察AI 封裝未來趨勢
Spotlight on CIS; COW(P)OS/FO-PLP/Substrate; Hybrid Bonding, SiPH/CPO, and related innovations
【Date & Time】October 23, 2025 (Thursday), 13:00 – 15:00
TPCA Show X IMPACT- SMTA-AI HW Process and Metrology : Soldering, Package, TGV and PCB
聚焦AI 封裝，銲接與玻璃通孔製程與電路板品質可靠度。
Focusing on AI hardware process and metrology from soldering, package design,TGV, and PCB reliability.
【Date & Time】October 23, 2025 (Thursday), 15:10 – 17:00
