2027 參展辦法
TPCA Show 自創辦以來，始終是台灣電路板產業與全球市場對話的窗口。二十多年來，我們見證產業從製程精進走向系統整合；如今，AI 伺服器、高效能運算與先進封裝重新定義了電路板的角色——它不再只是承載元件的基礎，而是連結晶片與系統的關鍵介面。
第 28 屆起，展會正式升級為「台灣電路板暨異質整合國際展覽會」。這不只是名稱的改變，更是對產業發展方向的回應：當載板、封裝與電路板的邊界日益模糊，展覽也必須跨出單一品類，涵蓋材料、設備、製造到封裝的完整供應鏈。
TPCA Show 相信，展覽的價值在於交流。我們以更完整的產業版圖、更精準的媒合平台，邀請全球夥伴於 2027 年 10 月齊聚台北南港，共同定義異質整合時代的新標準。
Since its founding, TPCA Show has been the window through which Taiwan's PCB industry speaks to the world. Over two decades, we have watched the industry evolve from process refinement to system integration. Today, AI servers, high-performance computing and advanced packaging are redefining the role of the circuit board—no longer merely a foundation that carries components, but the critical interface linking chip to system.
Starting with its 28th edition, the show is officially upgraded to the “Taiwan PCB & Heterogeneous Integration Exhibition”. This is more than a change of name; it is a response to where the industry is heading. As the boundaries between substrates, packaging and PCBs continue to blur, the exhibition must move beyond a single product category to embrace the complete supply chain—from materials and equipment to manufacturing and packaging.
The newly launched “Glass Core Substrate Taiwan” spotlights next-generation substrate technologies and packaging solutions, bringing together AI server, semiconductor packaging and substrate players so that key buyers and suppliers can connect directly on one floor.
TPCA Show believes the true value of an exhibition lies in exchange. With a broader industry landscape and a sharper matchmaking platform, we invite partners worldwide to gather in Taipei Nangang in October 2027—to define, together, the new standards of the heterogeneous integration era.