LaserVia AOIM
Model: LV2-2824-50-M, LV-3226-50-M
Category: Blind Via Inspector
Exhibitor: MACHVISION, INC.
Booth No: TBA
Characteristic
■Perfect for Large Window, Conformal, DLD, and Flip Chip laser drilling process. ■Dedicated and best-fit detection algorithm of inspection for laser via size, position, and tiny smear. ■Easy to learn and setup by one-touch operation. ■Offline SPC analysis is available and extra scan is not required when changing new defect inspection criteria.
Other Products
-
Reduction Solution Cu
-
Drilling CPK Analyzer
-
High-resolution Image detection camera
-
PVC/PP TRUE UNION BALL VALVE
-
Horizontal / Vertical desmear process
-
Wound Type Activated Carbon Filter Cartridge
-
PCB AVI
-
SR Descum
-
BGA/CSP/FCCSP/WLCSP
-
Deburr device
