LaserVia AOIM
Model: LV2-2824-50-M, LV-3226-50-M
Category: Blind Via Inspector
Exhibitor: MACHVISION, INC.
Booth No: TBA
Characteristic
■Perfect for Large Window, Conformal, DLD, and Flip Chip laser drilling process. ■Dedicated and best-fit detection algorithm of inspection for laser via size, position, and tiny smear. ■Easy to learn and setup by one-touch operation. ■Offline SPC analysis is available and extra scan is not required when changing new defect inspection criteria.
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