LaserVia AOIM
Model: LV2-2824-50-M, LV-3226-50-M
Category: Blind Via Inspector
Exhibitor: MACHVISION, INC.
Booth No: TBA
Characteristic
■Perfect for Large Window, Conformal, DLD, and Flip Chip laser drilling process. ■Dedicated and best-fit detection algorithm of inspection for laser via size, position, and tiny smear. ■Easy to learn and setup by one-touch operation. ■Offline SPC analysis is available and extra scan is not required when changing new defect inspection criteria.
Other Products
-
Handheld XRF Analyzer(Soil)
-
Flatting Machine
-
Desmear
-
Laser cut cleaner
-
In-Line Laser Marking System
-
Overload & dry-run protector
-
Developing of SR
-
ET Deburrer (for extremely-thin panels)
-
Diamond Coating Router-spiral cut router
-
PCB (2D3D)/AVI inspection equipment
