BGA/CSP/FCCSP/WLCSP

 

Model: 無

Category: Rigid Board

Exhibitor: UVAT Technology Co., Ltd.

Booth No: TBA

 

Characteristic

 

For the line.layering.via filling and through from the process.It can save the cost from the material and process and use low production costs ofin-line sputter system for the high technological process.

 

Other Products

 

• 

  Developing & Vacuum

• 

  Multilayer Inductive Bonding

• 

  Chamber Cleaner

• 

  Clay

• 

  Muraki-AUTO-ALIGNMENT WELDING MACHINE

• 

  Edge Computer

• 

  Developer

• 

  Dry type H class Transformer

• 

  Contract Service for OS Testing/ Film / Solder Mask

• 

  Heatsink Paste

 

 

 

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