BGA/CSP/FCCSP/WLCSP

 

Model: 無

Category: Rigid Board

Exhibitor: UVAT Technology Co., Ltd.

Booth No: TBA

 

Characteristic

 

For the line.layering.via filling and through from the process.It can save the cost from the material and process and use low production costs ofin-line sputter system for the high technological process.

 

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  WEVE Raman Microscopy / High-Resolution Materials Analysis Solution

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  Cleaning Roller

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  SHARP LCD PANEL LQ10D368

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  Activator AC-RF

 

 

 

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