BGA/CSP/FCCSP/WLCSP

 

Model: 無

Category: Rigid Board

Exhibitor: UVAT Technology Co., Ltd.

Booth No: TBA

 

Characteristic

 

For the line.layering.via filling and through from the process.It can save the cost from the material and process and use low production costs ofin-line sputter system for the high technological process.

 

Other Products

 

• 

  Vertical Panel / Pattern Plating

• 

  6 SPINDLES FOR BIG PANEL PCB DRILLING MACHINE

• 

  Wafer Mounter, UV Curing System, and Expansion Tool

• 

  HDI/ Flex AFVI

• 

  Direct Metalization

• 

  High temperature resistance filled membrance

• 

  CCD Depth-Control Routing Machine

• 

  High Precision Routing Machine

• 

  Panel Clean Machine

• 

  NIR InGas Cooled Camera

 

 

 

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