BGA/CSP/FCCSP/WLCSP

 

Model: 無

Category: Rigid Board

Exhibitor: UVAT Technology Co., Ltd.

Booth No: TBA

 

Characteristic

 

For the line.layering.via filling and through from the process.It can save the cost from the material and process and use low production costs ofin-line sputter system for the high technological process.

 

Other Products

 

• 

  Hole Inspector

• 

  CCL Laminating Vacuum Hot and Cold Press

• 

  Handheld XRF Analyzer(RoHS)

• 

  TDR Impedance Testing Instrument

• 

  Warpage Inspector

• 

  Horizontla Atmospheric-Presure Plasma Equipment

• 

  Copper Briightener

• 

  Digital Microscope with Laser-based Elemental Analyzer

• 

  Ultrasonic Cutting System for Cross-Section Observation

• 

  Deep Wound Type Filter Cartridge

 

 

 

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