SemiPOL High Precision Quantitative Grinding Machine
Model: SemiPOL
Category: Reliability Evaluation and Testing Equipment
Exhibitor: Trojan (Suzhou) Material Technology Co., Ltd.
Booth No: TBA
Characteristic
SemiPOL are capable of performing precise grinding and polishing of various materials (integrated circuits, semicon ductor wafers, optical components and optical fibers, petrographic structures, precision metal parts, etc.) for micro scopic (SEM, FIB, TEM, etc.) analysis. The target accuracy can reach micron level. It is mainly used for parallel grinding and polishing, quantitative thinning, continu ous slicing and other precision applica tions. With more accessories and fix tures, it can make the grinding and pol ishing of complex and special-shaped parts easier and more convenient. SemiPOL can monitor the amount of material removed in real time, or set the amount of material ground and achieve unattended operation. The servo drive motor can control the rotation speed and swing amplitude of the positioning head to improve the flatness and finish of grinding and polishing.
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