Ultra Thin FCCL (2L-FCCL) for Fine Pitch pattern

Model: Ultra Thin FCCL (2L-FCCL)

Booth No: TBA

Characteristic

◎This product is one of main upstream materials of FPC (Flexible Printed Circuit) ◎2L(2-Layer)FCCL without adhesive between PI and copper, can be used for advanced FPC manufacturing, such as fine pitch FPCs and tape COF FCCLs. ◎Using Roll to Roll(R2R) vacuum sputtering and chemical electroforming(electroplating) processes: Effectively reducing copper etching residues problems which normally happen on 3L-FCCLs. ◎Copper thickness is between 2um and 8um, suitable for fine pitch (Pitch<30um) layout design. ◎Product features include: high heat resistance, fine flexural/bending endurance, good peel strength, copper layer uniformity, and dimensional stability.